1. 2. 3. material content data sheet sales product name tle4271-2s issued 28. august 2013 ma# MA000723262 package pg-to220-7-12 weight* 2154.16 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.930 0.23 0.23 2289 2289 leadframe non noble metal iron 7439-89-6 0.908 0.04 422 inorganic material phosphorus 7723-14-0 0.272 0.01 126 non noble metal copper 7440-50-8 906.793 42.08 42.13 420949 421498 wire non noble metal aluminium 7429-90-5 0.437 0.02 0.02 203 203 encapsulation organic material carbon black 1333-86-4 1.256 0.06 583 plastics epoxy resin - 57.776 2.68 26820 inorganic material silicondioxide 60676-86-0 568.965 26.41 29.15 264123 291526 leadfinish non noble metal tin 7440-31-5 23.005 1.07 1.07 10680 10680 plating non noble metal nickel 7440-02-0 0.216 0.01 100 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 100 solder noble metal silver 7440-22-4 0.151 0.01 70 non noble metal tin 7440-31-5 0.120 0.01 56 non noble metal lead 7439-92-1 5.749 0.27 0.29 2669 2795 heatspreader inorganic material phosphorus 7723-14-0 0.175 0.01 81 non noble metal iron 7439-89-6 0.584 0.03 271 non noble metal copper 7440-50-8 582.824 27.06 27.10 270557 270909 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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